Glossary of Terms -
Analog - non digital components, transistors,
diodes, amplifiers.
Bypass Capacitor - decoupling capacitors, between
ground and the voltage plane.
Cadence Allegro - an advanced environment for the
physical design of complex multi-layer printed circuit
board designs.
Ground Plane - Dense pcb designs, or high frequency
designs require special considerations. A separate layer
designated for ground is required.
LSI - Large Scale Integrated circuits.
Orcad Capture® - whether you're designing a new
circuit, revising the schematic diagrans for an existing
PCB, or drafting a block diagram of HDL modules.
Pad - circular, oval or rectangular copper trace
that is drilled and lined with a copper ferril, with
another pad on the other side of the pcb. Pads are
arranged to accept integrated circuits (IC's) or
components.
PADS PCB - Desktop PCB design tool.
PCB - See printed circuit board
|
Printed Circuit Board (PCB)- A substrate
generally composed of fiber and resin with conductors on
either side or embedded within multiple layers. The
copper conductors in the board are created by an etching
process during the manufacturing process. The copper
lands are then printed with a silkscreen solder mask,
the mask is then over printed with the component
locations. The current generic standard for PCB
manufacturing is IPC-2221A, this pertains to single,
double or muti-layer printed circuit boards.
Schematic - An accurate drawing designating IC's
with designations and pin numbers, bypass capacitors and
analog devices. A schematic should be drawn with the pcb
design in mind.
Schematic Capture - Software like Orcad used to
input the electronic design and create the schematic.
Solder Mask - a printed ink "mask" which
is screen printed on the top and bottom surface of the
PCB protecting the surfaces.
SMT - Surface Mount Technology
devices are mounted /soldered to the surface
of the printed circuit board.
|
Trace - electrical conductor interconnecting
electronic components, otherwise known as a land or
track. Proper clearances between traces must be observed
to avoid tracking or flash-over between between traces.
USB Flash drive - a memory device capable of holding
Giga bytes of storage. Can be used for sending files.
Via - interconnects tacks (lands) between pcb layers
or sides through electrically plated through holes (PTH).
VCC - like a ground plane, the VCC plane is a layer
dedicated voltage plane.
|